台湾 DigiTimes の報道によると A16 わ 18A プロセスの裏面給電なんていう半導体製造技術的なスーパーチップになるとのコト
https://www.eetimes.com/tsmcs-a16-process-moves-goalposts-in-tech-leadership-game/
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A16, for the first time, will combine TSMC’s Super Power Rail architecture with nanosheet transistors. The company expects logic density and performance to improve by dedicating front-side routing resources to signals, making A16 ideal for high-performance computing (HPC) products with complex signal routes and dense power delivery networks. The A16 node, compared with TSMC’s 2-nm process, will provide 8-10% speed improvement, 15-20% power reduction at the same speed and up to 1.10× chip density improvement for datacenter products, according to the company.
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M1 で業界を驚愕させた後わマイクロ・アーキテクチャ的にはパッとしない Apple すけど、増えたトランジスタ密度をどう使うのやら。。。